Wafer Dicing Blade

Key Features

High quality wafer dicing bladeLong-life substrate singulation dicing bladeWide range of grit sizesVariable bond hardnessChoose from three different diamond concentrationsReduced vibration for superior cut qualityHubbed dicing blades for all OEM equipment

Kulicke and Soffa (K&S) manufactures a full range of hub wafer dicing blade for a variety of advanced applications and materials, including cutting of silicon, compound semiconductor, glass wafers etc. The blades are suitable for use on all OEM manual and automatic wafer saws, including ADT, Disco, Accretech, Loadpoint etc.

Nearly three decades of experience in sophisticated dicing blade technology have shown that meeting the desired objectives for cut quality, throughput and blade life requires matching the material to be cut, with the appropriate blade composition and geometry.

The K&S range of hub dicing blades for cutting Silicon, GaAs, InP wafers and package singulation feature various grit sizes, diamond concentrations, bond hardnesses and hub configurations, are optimised to deliver maximum cut quality, throughput and blade life.

In addition to blades for cutting wafers, K&S also produce high-quality hubbed dicing blades for package singulation and discrete devices, which incorporate the latest technology to enhance process stability, blade lifetime and cut quality.

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K&S - AccuPlus Dicing Blades

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