Tresky T-3002-M Series Manual Die Bonding Systems

Tresky T-3002-M Key Features

Manual Die Bonder with pickup from up to 200mm sawn/scribed wafer For epoxy, eutectic-solder, flip chip & sinter die attach processes etc.Precision die to die and die on die placement capabilityIntegrated time pressure dispenser, optional stamping unitTrue Vertical Technology™, guarantees parallelism during bondingSimple to use with excellent ergonomics & high build qualityModular system covers virtually all die pick-place applications

The T-3002-M Manual Die Bonder is a high precision, operator controlled machine for picking and placing bare semiconductor devices from up to 200mm (8?) wafer or 2/4? waffle packs or GEL paks, passive components and other devices used in Microelectronic and related assemblies.

The equipment features superior ergonomic design, high-accuracy and a large 220 x 220mm assembly area with 95mm of Z travel, making it ideal for R&D through low volume production or custom assembly requirements.

Applications include:

Assembly of Hybrid Microelectronic DevicesConductive & Non Conductive Epoxy Die AttachEutectic Soldering of DevicesFlip Chip BondingThermo-compression & Ultrasonic BondingEpoxy Dispense or StampingLaser Bar StackingPCB Chip-on-Board etc.Die Sorting to Waffle or Gel Pak

All models feature Treskys' True Vertical Technology™, which guarantees parallelism between chip and substrate at any bond height, plus integrated time/pressure dispensers.

The modular T-3002 system also includes an extensive range of options, comprising: Beam splitters for Flip-chip applications, Eutectic Scrub & Gas Heating for Eutectic Die Attach, Solder / Epoxy Dispenser, Epoxy Stamping, Pickup Tool Heating, Ultrasonic Bond Heads, Secondary Preform Spindle, Flip Chip Station, Waffle & Gel Pak Tooling, Substrate Holders, Static and Dynamic Heating Plates and alignment / inspection options.

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Tresky T-3002 Technical Downloads

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T-3002-M Manual Z Axis, Pick up from Wafer or Waffle / Gel-Pak etc.

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