Thick Film Gold Conductors

Gold Conductive Pastes Key Features

Suitable for all processes - etchable, solderable, etc.Gold and aluminium wire bondableWide range of firing temperatures (500 - 1,050�C)Thinners available for extended working life (information on-demand)

Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thick-film pastes for a wide variety of Hybrid Microelectronic applications.

Their Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.

The range of Silver-bearing pastes includes conductor materials, termination metallisation's, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free materials.

Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free products.

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Thick Film Conductive Pastes Technical Downloads

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Koartan Thick Print Gold Paper - IMAPS2002

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