Thermally Conductive Die Attach Adhesive

Thermally Conductive Die Attach Adhesive Key Features

Aluminium nitride-filled epoxy for enhanced thermal conductivityHigh die shear strengthVery low water absorptionSemi-flexible for larger componentsVery low temperature curing for sensitive substrate materials

With excellent adhesion to a wide variety of substrates (FR4, LCP, ABS, etc.), DELO's thermally conductive die attach adhesive meets an extensive range of customer requirements and specifications. Wherever thermal conductivity AND electrical isolation are required, DELO MONOPOX TC die attach adhesives are recommended.

The adhesives are used in widely differing die bonding applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.

With a low CTE value (22 ppm / °K) and a comparatively high elongation-at-tear (11%), DELO MONOPOX TC2270 adhesive will withstand most thermal cycling requirements. In addition, it meest the requirements of JEDEC MSL Level 1, resulting in an adhesive suitable for high reliability die attach applications.

More detailed information on DELO's range of die attach adhesives can be found here.

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Technical Downloads

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DELO Die Attach Process Solutions Brochure

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DELO MONOPOX TC2270 Technical Data Sheet

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DELO Bonding in Electronics Brochure

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