SRO-714 / SRO-716 Vacuum Solder Reflow Batch Ovens

SRO-714 / SRO-716 Key Features

Small Footprint, Freestanding Vacuum Reflow OvenTouch TCs with Quick Swap HotplatesMaximum Temperature 450°C, (optional 700°C)Temperature ramp-up rate 3.5K/secUp to 100 process steps per profile recipeAutomatic Chamber Opening / Closing Optional Top HeatingHeated Area up to 314 x 314 mm (716)Oxygen < 1 ppm Optional High-Pressure Atmosphere: up to 3 bar (abs)Formic Acid, H2 or Solder Paste Activation

The ATV SRO-71X series standalone IR vacuum reflow ovens are the benchmark for R&D, low volume pilot line and medium volume batch production. Both the 714 and 716 produce high quality results with outstanding process stability and repeatability.

The system is fully capable of working with any customer soldering requirements including: flux-less soldering, eutectic die attach, gold tin soldering, void-free soldering, hermetic lid sealing, formic acid processing and flip chip soldering.

The oven is a small footprint standalone unit, only 760 mm wide x 1200 mm deep.

Reflow profiles are created simply using ATV's WIN-ATV software, which allows the user to program up to 100 process steps to create the ideal profile.

Products are then reflowed via IR lamps in the polished stainless steel cold-walled reflow chamber, in a controlled environment, resulting in excellent void free solder joints.

SRO-716 Open chamber with substrates

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SRO-714 / SRO-716 Technical Downloads

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ATV SRO 714 / 716 Batch Vacuum Solder Reflow Ovens Brochure

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