Silicon Wafer Manufacturing

DELO-DUOPOX Key Features

Fast curing at room temperatureLow-high viscosities and gap-fill versions availableUniform stress distribution with long-term durabilityExcellent adhesion to similar and dissimilar substrates

Cutting individual wafers from silicon ingots is a delicate operation, as the ingot needs to be held in such a way that the silicon is not damaged. This is achieved by using a removable DELO-DUOPOX two-part epoxy to bond the ingot onto a glass substrate. After the adhesive is cured, the ingot is cut into the individual wafers by an EDM process. The adhesive is then removed by immersing the assembly into a 15% formic acid solution, at 80C, for three minutes. This ensures optimal yields for the wafers.

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Silicon Wafer Adhesives Technical Downloads

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DELO-DUOPOX Selection Chart

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DELO Bonding in Electronics Brochure

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