SB6/8 Gen2 Wafer Bonder

SB6/8 Gen2 Key Features

SB6 Gen2: Irregular pieces up to 150mm wafersSB8 Gen2: Irregular pieces up to 200mm wafers Bond-Force up to 20kN and Temperature up to 550°CPrecision Temperature Control and unrivalled Uniformity < 1.5% Fast Heating / Active Cooling = Reduced Process CycleErgonomic, Contamination Free Wafer Loading Semiautomatic operation for high Repeatability & ReproducibilityChamber pressure from 5 x 10-5mbar to 3bar absoluteVarious tooling options to cover a wide range of applicationsOpen and Closed Fixtures & Centre Pin options for Fusion BondingMulti-Bond Fixtures for stacks and multiple wafer sizes

The SB6/8 Gen2 from SUSS Microtec is the state of the art universal wafer bonder for substrates, irregular pieces and wafers up to 200mm in diameter. Supported bonding processes include: Adhesive Bonding, Anodic, Eutectic or Fusion Bonding, Glass Frit processes and Temporary Wafer Bonding.

The semiautomatic system takes over from the operator once the wafer bond fixture is placed on the machine to automatically load the fixture into the bond chamber, protecting the operator from hot surfaces and pinch points while simultaneously avoiding contamination and variation in processing through human error.

The highly accurate temperature and force control technology within the SB6/8 Gen 2 provide unrivalled uniformity to the bonding process, making the SB6/8 Gen 2 the ideal system for Research & Development. Applications include MEMS device fabrication, advanced packaging, 3D integration and photonic systems manufacture.

The SB6/8 Gen2 is suitable for both packaging as well as structuring; meeting the requirements for advanced packaging, LED, MEMS, and 3D integration.

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SB6/8 Gen2 Technical Downloads

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SÜSS MicroTec SB6/8 Universal Wafer Bonder

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