RV-129 Precision Diamond Scriber
Key Features:Accurately scribe up to 200mm Diameter Substrates / Wafers up to 10mm thickAdjustable scribe angle, length, height and pressurePrecision scribe alignment via monocular scope and X-axis micrometerRotating chuck with four 90 degree mechanical stopsScribe a wide range of materials: Silicon, GaAs, InP, Silica, Glass etc.
The precision RV-129 Scriber from ATV Technologie is a bench mounted system, which provides accurate scribing / cutting of devices, including wafers (Si, GaAs, InP etc.), ceramics, thin film & PV materials, thick film substrates, glass or silicon components etc.
All essential operating parameters, including the angle of the scribing tool, scribing force, touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeat-ability of results.
The scriber incorporates a rotating X -Y table with universal vacuum chuck for any size wafers up to 8" diameter or square devices up to 8? x 8?. A 50 X magnification Microscope with cross hair and coaxial illumination allow precise alignment of the scribe tool.
1234PreviousNext
RV-129 Precision Diamond Scriber Technical Downloads
File
ATV Precision Diamond Scribers Datasheet?
Download
Visit the Inseto (UK) Ltd website for more information on RV-129 Precision Diamond Scriber