RV-126/7 Manual Diamond Wafer Scriber

Key Features:

Simple and accurate manual diamond wafer scriber Fast and easy scribing of ceramics, glass, silicon, GaAs, InP and many moreNo maintenanceMultipurpose tool with 4 cutting edgesAdjustable scribing forceAdjustable substrate thicknessPrecise step and repeat via mechanical stopper on rulerAlcohol lubrication: longer tool lifetime; enhances cleaving by capillary effect

This reliable Manual Diamond Wafer Scriber performs fast, easy and precise scribing and cutting of silicon wafers, as well as thin and thick film ceramic and glass substraits. It forms the grooves necessary for effective glass or ceramic cutting: shallow, even and continuous.

All essential operating parameters - the angle of the scribing tool, the scribing force, the touchdown point and the lift up point of the tool are precisely adjustable to ensure optimal flexibility and repeatable results.

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