Plasma Asher / Plasma Cleaner: PE-75

PE-75 Key Features

Large Chamber, Suitable for 200mm WafersRobust design, ideal for R&D labs and UniversitiesContinuously variable power settingSimple to program and operatePC Control option for automated processingSuitable for Ashing or Cleaning Applications

The PE-75 Plasma Asher / Plasma Cleaner is our largest entry level plasma treatment system, including all the features of the PE-50-XL, but with a larger circular aluminium vacuum chamber that is 250mm (10?) in diameter and 270mm (10.75?) deep with a direct powered RF electrode for processing up to 200mm (8?) parts.

When fitted with a high power RF source (13.56 MHz), the PE-75 is a popular choice for use as a plasma asher. Although all of our systems are versatile and can perform many tasks without changing configuration settings, the PE-75 is the best value in the industry for plasma ashing; the process of removing photoresist from an etched wafer. When fitted with a lower power RF source (400W 50KHz), the system also excels at plasma cleaning and surface modification applications.

PE-75 features include:

Durable Welded Round Aluminium Vacuum ChamberChamber Dimensions: 250mm Dia x 270mm DeepSingle 225mm Wide x 250mm Deep Electrode140mm Chamber Height Clearance400W, 50 KHz Continuously Variable RF SupplyOptional high power 13.56MHz Supply2 Rotometer Gas Control 0-25cc/minThermocouple Vacuum Gauge, 0-1TorrPLC Microprocessor Control SystemKeypad user interface with alphanumeric displayStorage of one Process RecipeAutomatic Process Sequencing5 CFM Oxygen Service Vacuum PumpPump footprint 175x400mm (7" x 16")Console Dimensions: 455x480x610mm (18x19x24?)Electrical: 230/240VAC, 14AAvailable in Venus configuration with PC Control

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PE-75 Technical Downloads

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PE-75 Datasheet

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