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Package Lid Sealing Reflow Ovens with Getter Activation

Package Lid Sealing Reflow Ovens Key Features

Thermal (450°C / 500°C) & Electrical (20W) Getter ActivationTop and Bottom Heater ArraysIndependent Control of Package & Lid Temperature Vacuum: <1 x 10-6 mbarHigh flexibility: different packages at same time possiblePrecision alignment of lids and packagesOxygen < 0.1 ppmUnlimited Process RecipesUp to 100 process steps per reflow profile Small Footprint Free-Standing System

Based
on the successful SRO 706 series vacuum reflow oven, ATV's SRO 706 Getter
System has been developed to process both thermal and electrical getter
requirements under controlled atmosphere or high vacuum. This process has also successfully been
applied to other sectors including package sealing of Kovar lids or optical
windows under high vacuum for various MEMS applications.

The
system utilizes ATV's proven IR heating technology with independent arrays of
IR lamps providing top and bottom heating within the chamber for superior
heating uniformity under vacuum. This
results in a maximum thermal activation temperature of 450°C or
electrical activation of up to 20W; in either case, the sensor / chip
temperature does not exceed 100°C.
Optional Residual Gas Analysis (RGA) can be performed during the sealing
process to measure the internal package atmosphere.

ATV's
proven SRO series of solder reflow ovens are extensively used for standard void
free lid-sealing applications on ceramic, multi-layer LTCC and other hybrid
packages. Where Getter activation is required, ATV have developed enhanced
solutions, which provide improved vacuum capability for MEMS and other
applications, thermal getter activation whilst protecting the core package
temperature and precision tooling for package to lid alignment etc.

Reflow
profiles are created simply using ATV's proven Win-ATV software, which allows
the user to program up to 100 process steps per profile.

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Package Lid Sealing Reflow Ovens Technical Downloads

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SRO 706 Getter Brochure

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