PA - Metal Pin Relay Housing

DELO MONOPOX Key Features

One-part materials that require no mixingCuring temperatures from 60°CExcellent temperature and chemical resistanceElectrically conductive and non-conductive versions

DELO DUALBOND Key Features

Initial cure with light for handling or securing Full cure with light or heat or moisture Ideal for applications with shadow zones Excellent adhesion to many substrate materials

Typically in a sealing application like this, an adhesive with excellent flowing behaviour and very good wetting is required. In addition, the adhesive also needs to have high humidity resistance and be able to withstand temperature extremes. For devices that have shadow areas in the bonding zone, a dual-curing adhesive with a secondary humidity-curing mechanism can be used.

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PA - Metal Adhesives Technical Downloads

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DELO Adhesives for Plastic Bonding Brochure

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DELO MONOPOX Selection Chart

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DELO DUALBOND Selection Chart

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DELO LED Curing Lamps Overview

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