Non-Conductive Die Attach Adhesive

Adhesive Key Features

High purity non-conductive die attach adhesiveMinimum out-gassing, epoxy adhesive base materialCure options include fast curing in secondsOptional light-fixing capability significantly reduces process timesAdded benefit of precise placement accuracy - elimination of movement during heat-cureVery low cure temperature of 60°C also available

With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, LCP, PETP, etc.) and an extended working life, DELO's non-conductive die attach adhesives meet an extensive range of customer requirements and specifications.

The adhesives are used in widely differing die bonding applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.

Light-fixing the visible fillet of adhesive around the die takes as little as 1 second, and this ensures that there is no movement of the die between die placement and curing. Heat-curing is mandatory, and can take as little as 10 minutes at 100°C or 30 minutes at 80°C.

More detailed information on DELO's range of non-conductive range of die attach adhesives can be found here.

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Non-Conductive Die Attach Adhesive - Technical Downloads

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DELO Die Attach Adhesives Selection Chart

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DELO Process Solutions for Die Attach Brochure

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DELO Bonding in Electronics Brochure

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DELO DUALBOND BS3770 Technical Data Sheet

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DELO DUALBOND LT354 Technical Data Sheet

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DELO DUALBOND OB749 Technical Data Sheet

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DELO DUALBOND OB787 Technical Data Sheet

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