Industrial Plasma Etching Equipment: MK-II

MK-II Key Features

High volume PCB Etching System, De-smear and Etch BackLarge Processing Chamber with up to 24 Electrode ShelvesRuns with any process gas, giving you the most application flexibility Uniform etch rates across the PCBProcess temperature control (Patented)

The Mark II (MK-II) industrial plasma etcher is the choice of discerning manufacturers, providing processing repeatability with reliability, long life and low maintenance costs. We can also modify or custom build a system to meet your specific needs.

The MK-II plasma treatment system utilizes two key technological patents developed by Plasma Etch, Inc. that when combined, produce superior results and the fastest etch rates and cycle times, ideal for PCB etching and similar applications. The system offers technological advantages such as the unique combination of process temperature control and electrostatic shielding. Both work in harmony to produce the most consistent, most uniform, and most reliable etch rates obtainable across surfaces.

The generous aluminium chamber accommodates a large active processing surface with our standard configurations having as few as 6 or as many as 24 plasma processing levels, each 600 x 4501mm (24�18") The oxygen service vacuum pump and booster is equipped with a two point purge system to minimize any corrosive end products forming in the pump thereby extending the service life while lowering maintenance costs.

MKII standard features include:

6, 8, 12, 16 & 24 "Shelf" Systems availableEach shelf is 24" x 18" on 1.5? SpacingR.F. Generator & Automatic Matching NetworkR.F. 1250 to 5000 Watts @ 13.56MHzElectrostatic Shielding of chamber for uniformityProcess Temperature ControlTwo Mass Flow Controllers, 0-2000 SCCMLow gas supply pressure alarmsMKS 0-10 Torr Capacitance Vacuum GaugeMicroprocessor Control SystemTouch Screen interface with Multiple Recipe StorageEdwards Oxygen Service Vacuum PumpEdwards Roots style Booster Blower3 Micron Vacuum Pump Oil FiltrationTwo point Automatic N2 Pump PurgingOil Mist Coalescing Filter on the Vacuum PumpFootprint, Plasma Console 1680x2000x660mmFootprint, Vacuum Pump 400x760x430mmWeight varies with configuration

Optional System Features:

Windows Computer Control SystemData Recording, Reporting and printingSignal Light TowerEdwards GV80 Dry Vacuum PumpMKS Automatic Throttle Vacuum ControllerUp to 4 Mass Flow ControllersProcess controlled Gas steering matrixControlled Rate N2 Chamber PurgingCustom Chamber sizes and configurationsCustom Electrode sizes and configurationsClosed Loop Chiller for RF generator coolingPacked Bed Fume Scrubber for vacuum pump exhaustHeatless Compressed Air Dryer

Please contact us for the full range of options.

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MK-II Technical Downloads

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MK-II Datasheet

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