Glob Top Encapsulation Adhesives

Adhesives Key Features

High purity glob top adhesives for encapsulating bare dieEpoxy base materials, developed for glob top applicationsLow CTE to prevent substrate warp-age and breaking of wire bondsHigh Tg to minimise stresses, both during and after cureExcellent protection against mechanical stresses (temperature, vibration, etc.)Very high chemical resistance, e.g. automotive fluids, printing inks, etc.

Glob top protecting of small die is achieved by dispensing an adhesive onto the surface of the die until a dome is formed that covers the die and the wire bonds. It is generally suitable for encapsulation areas < 2mm x 2mm, as the dome becomes too high for larger areas (another process, called Dam & Fill) is used for larger area encapsulation.

The adhesive is then cured either by heat (~ 20 minute cure time at 150°C), or by light (< 1 minute cure time, depending on the intensity of the UV lamp). Care needs to be taken during the curing process that the adhesive doesn't slump, leaving either the bond wire or the die surface exposed.

Encapsulation adhesives have a low CTE to minimise the stress placed on the wire bonds, and can withstand operating temperatures from -65°C to +180°C (product dependant). In addition to protecting the die, they also provide excellent chemical resistance, and are high purity adhesives to reduce outgassing.

More detailed information on DELO's range of encapsulation adhesives can be found here.

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