Encapsulation Adhesives

Encapsulation Adhesives Key Features

High purity adhesives for bare die encapsulationGlob-top and daml & fill materialsLow CTE to prevent substrate warpage and breaking of wirebondsHigh Tg to minimise stresses, both during and after cureExcellent protection against mechanical stresses (temperature, vibration, etc.)Very high chemical resistance, e.g. automotive fluids, printing inks, etc.Option of heat-cured or UV-cured product ranges

Protecting bare silicon die is done in a variety of ways, by over-moulding in traditional semiconductor packaging, in metal hermetic packages, or by glob top adhesive encapsulation on organic substrates.

Depending on the die size, either a single-stage glob top is used or, for larger die, a two-stage process of damming the die with a high-viscosity adhesive and filling the enclosed space with a low-viscosity compatible adhesive.

For useful information on choosing the right glob top adhesive for encapsulation, or help in understanding the terminology, and processing and technical guidelines, please look at our Knowledge Base Fact Sheet here.

DELO's family of heat-cured anhydride-curing epoxies offer significant advantages to the user:

Dam heights of 3mm and aboveSimultaneous curing of Dam and FillFast curing times of 20 minutes at 150°COptional low-temperature cure temperature at 100°COperating temperature range from -65°C to +180°CLow CTE's of < 25ppm for thermal mis-match compensationHigh Tg's of approx. 180°C, with decomposition temperatures in excess of 320°CExcellent chemical and media resistanceCompliance with JEDEC MSL 1 requirementsThermal shock resistance of > 1,000 cycles from -40°C to +150°CHigh purity with < 10ppm ionic impuritiesLow humidity sensitivity with < 0.1% water absorption

In addition, DELO offers UV-cured epoxies for:

Very fast curing (seconds)Short cycle times = high volume assemblySimultaneous curing of Dam & FillOperating temperature range from -40°C to +150°CExcellent chemical and media resistanceHigh purity with < 10ppm of Na+, K+, Cl- ions

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Encapsulation Adhesives Technical Downloads

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DELO Potting Compounds & Encapsulants Brochure

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DELO Encapsulation Selection Chart

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DELO Bonding in Electronics Brochure

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DELO LED Curing Lamps Overview

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