Dual Spindle Semiautomatic Dicing Series 7900Duo

7900 Key Features

Advanced dual spindle wafer dicing systemModels for up to 200x200mm or 250x250mm devicesQuick allignment function for broken or partial wafersLow vibration spindles enable superb cut qualitySmall footprint & low cost of ownership

The 7900 Series - Taking your productivity to the edge.

As part of the growing market to dice small discrete devices and the on-going demand to lower the cost of production per unit, ADT has responded with a dual spindle system model 7900 Duo that double the productivity while maintaining the same current production floor space.

The 7900 Duo system provides a perfect solution for applications that require a long cut cycle time such as image sensors and saw devices.

Further to the automatic vision and easy Graphic User Interface (GUI), ADT is offering a unique feature for processing and programming of broken wafers.

7900 Series Advantages:

Two facing spindles enable simultaneous dicingLow vibration platformFast automatic alignment and cut positioning increase throughputSmall footprint reduces cost of ownershipAutomatic Kerf inspection increase yieldAutomatic Y offset correction ensures maximum precisionTape surface detection ensures consistent cut qualityTouch screen user interface

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7900 Technical Downloads

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7900 Series Datasheet

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Principles of Dicing

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