Benchtop Plasma Cleaning System: PE-50

PE-50 Key Features

Compact designPLC control system with recipe storageTwo gas input linesOptional plasma etching 13.56MHz RF sourceFor processing up to 100x150mm (4�6?) Samples

This PE-50 advanced Benchtop Plasma Cleaning System offers many features not found in competitive units, including: automatic program sequencing, recipe storage, continuously variable RF power supply and an aluminium process chamber etc.

The PE-50 plasma cleaner is used to remove organic and inorganic contamination, increase wettability, increase bond strength, and remove residue. The process is effective on a variety of materials used in an even greater variety of products. This model is made for smaller production facilities, research and development labs, testing facilities and universities.

As in all Plasma Etch cleaning systems, the PE-50 utilises a capacitive parallel plate design for the most effective plasma generation and is suitable for processing up to 100x150mm samples. In addition, an optional 13.56MHz source enables high speed processing or isotropic etching, using O2 or CF4 type gases etc.

PE-50 features include:

Durable Welded Aluminium Vacuum ChamberChamber Dimensions: 140Wx180Dx90Hmm (5.5?x7?x3.5?)Single 115Wx150Dmm (4.5?x6?) RF Powered Electrode150W, 50KHz Continuously Variable Power Supply2 Rotometer Gas Control 0-25cc/minPirani Vacuum Gauge, 0-1TorrPLC Microprocessor Control SystemKeypad user interface with alphanumeric displayStorage of one Process RecipeAutomatic Process Sequencing5 CFM Oxygen Service Vacuum PumpConsole Dimensions: 350Wx365Dx450Hmm (14x14x18?)Approximate Shipping weight is 40KgElectrical: 230/240VAC, 14A

Options:

Dry Vacuum Pump150W, 13.56MHz Generator & Automatic Matching NetworkLight Status Traffic Light BarMass Flow Meter

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PE-50 Technical Downloads

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PE-50 Datasheet

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