Automatic Advanced Packaging Die Bonder Equipment: Amadyne fab1

Amadyne fab1 Key Features

Advanced packaging die bonder equipmentSuitable for die sorting and bar handling requirementsFlexible platform with excellent placement accuracyFor all die attach applications plus custom requirementsLarge working area and small footprint (<1.2Msq)Automatic tool change (15 tool holders)Up to one 300mm or two 200mm wafer eject capabilityAutomated inline or batch configurations

The fab1 advanced packaging die bonder equipment for inline or batch processing, offers improved speed and accuracy and incorporates the very latest in motion control & software technology, whilst not compromising on flexibility. The system is housed inside a novel cabinet, which incorporates particulate control filters, system status illuminators and an exceptional working area for larger devices, which can also accommodate up to two wafers for parallel processing.

The fab1 is a versatile automatic die attach system capable of handling an extensive range of components of different sizes, as well as for applying adhesives.

Flexibility, ease of operation and a wide variety of options in a compact footprint, permit the fabrication of standard and advanced micro-system devices. The equipment's open architecture also permits non-standard and customised processes to be easily integrated.

The system is capable of batch or inline processing, with excellent user access for loading and unloading product. A sophisticated graphical user interface (GUI) with expert panels for step by step guidance simplifies both programming and operation.

System features:

X,Y,Z & T handling of componentsStandard & advanced packaging processes: COB, MCM, COC, FC, Flip Chip etc.Single or double level systems with extensive working areasMultiple input presentation formats: Wafer, SMT, Waffle, Carrier etc.Handling non-standard components: Substrates, Lids, Carriers etc.Multiple output presentation formats: PCB, Substrate, Packages, WP, Wafer, Boat etc.Different methods for applying adhesives: stamping, jetting, dispensing etc.Stand alone or In-line configurationsHeated substrate or pickup tooling availableAdvanced graphical user Interface with OPT & CAD ImportIntegrated clean environment with Filtration Flow BoxAutomatic tool change with 15 positionsMagazine or presentation liftersOpen architecture with customization possibleLow cost of ownership

The fab modules also offer an extensive list of software and hardware features.

123456PreviousNext

Amadyne Fab1 Technical Downloads

File

New fab1 Series data-sheet coming soon!

Download