967 Semi-Automatic Wafer Mounter

967 Semi-Automatic Wafer Mounter Key Features

Automatic mounting process with hands free operation Minimal footprint - Tabletop designOperator friendly; quick and simple to use and maintainMinimal tape usageFast, Accurate and Bubble Free MountingMounts up to 120 wafers per hourAdjustable roller pressureCompatible to all dicing tapes and frames (Up to 8?)

The 967 Semiautomatic Wafer Mounter from ADT is a small footprint user friendly system for automatic bubble free mounting for wafers up to 200mm, onto either standard blue or UV tapes.

The 967 provides fast, accurate mounting, avoiding the risks associated with manual systems. Once set, the same sequence is used for each wafer, thus ensuring high quality and consistent results. Process parameters, such as Roller pressure, Chuck temperature and Mounting speed, can easily be set using the user-friendly interface.

The 967 Wafer Mounter is also designed to minimise or reduce mounting costs, using all standard dicing tapes (pre-cut tape is not required), lowering the tape usage by as much as 25% compared to manual mounting. The low air and power consumption makes the 967 very economic.

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967 Semi-Automatic Wafer Mounter Technical Downloads

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ADT 967 Semi-Automatic Wafer Mounter Datasheet

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Principles of Dicing

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