966 Manual Wafer Mounter

966 Key Features

Versions for up to 200mm and 300mm wafersVersions for square substrates and panelsUniform mounting without air bubblesCompatible with UV or regular tapesBuilt-in reeling and removal of UV tape backingEngraved chuck markings aid substrate alignmentCompatibility with all film frames; linear & circular tape cutting

The 966 Manual Wafer Mounter from ADT is a small footprint system for bubble-free mounting onto standard or UV tapes, for up to 200mm or 300mm wafers or devices.

The systems incorporate a configurable wafer chuck with optional soft contact materials for thin or fragile wafers etc., non-contact capabilities for sensitive or bumped wafers and multi-panel or custom options, plus are compatible with all film frame types, including linear and circular.

Features include:

Handles wafers up to 200mm or 300mmCompact, table-top designControlled- temperature platenBuilt-in vacuum generatorUniform tape tensioningAdjustable Spring-Loaded PlatenCustom chucksUV tape liner removalBubble free MountingOptional non-contact mode

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966 Manual Wafer Mounter Technical Downloads

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ADT 966 Manual Wafer Mounter

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Principles of Dicing

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